Break-Through In Heat Transfer
The MasterAir G100M Heat column technology is a two-phase heat transfer involves the liquid-vapour phase change (boiling/evaporation and condensation) of a working fluid. The fluid is transferred by the copper powder filled inside the column creating an anti-gravity heat transfer.
7x Larger Diameter than Heatpipes
Super quick heat transfer is made possible with Heat Column at a massive Ø41.2, the equivalent of 7X the size of traditional heatpipes. The unification of heatpipes and base into one unit captures and efficiently transfers the heat from CPU like never seen before
Low Profile for Mini-ITX Builds
The low profile G100M stands at 74.5mm, a great fit for slim PC cases, including mini-ITX cases. Even at these small dimensions, the heatsink has cooling capacity of 130W TDP.
RGB Led Illumination (Controller Included)
A wired RGB LED controller is included with the G100M to personalize the RGB lighting anytime you want (no software needed). Switch it up depending on your mood, the possibilities are not limitless.
Top Down Air Flow Performance
A high performance 92mm PWM fan with a range of 600 ~ 2400 RPM, cools not only the CPU, but all surrounding components inside the case for exceptional thermal results.
Quick and Easy Installation
Tool-free mounting kit makes installation a breeze. Universal retention brackets are included, with full compatibility for:Intel® LGA 2066 / 2011-v3 / 2011 / 1151 / 1150 / 1155 / 1156 / 1366 / 775AMD® AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1.