JEDEC Standard Power Supply
The module supports both 1.35V and 1.5V power supplies, in line with JEDEC standards. This dual-voltage capability ensures compatibility with a wide range of motherboards, enhancing the module's flexibility for various system requirements.
High Frequency and Capacity
Designed to operate at a high frequency of 800MHz, which translates to a data rate of 1600Mb/sec per pin, the module offers an ample capacity of 8GB. This combination provides a balance of speed and storage, suitable for demanding applications and multitasking.
Programmable CAS Latency
The memory module allows for programmable CAS latencies ranging from 11 down to 6, enabling users to fine-tune performance based on their specific needs and system configurations. This feature aids in optimizing the balance between latency and throughput.
Internal Banks
With 8 independent internal banks, the memory architecture is designed to enhance performance by facilitating parallel operations. This structure helps in improving the efficiency of data handling and access, leading to faster processing times for applications.
Burst Length Options
Supporting burst lengths of 8 and 4, the module offers flexible configuration options for optimized read and write operations. This feature enables efficient data transfer and can be tailored to match the performance characteristics of different types of applications.
Bi-directional Differential Data Strobe
The inclusion of a bi-directional differential data strobe enhances data integrity and performance by providing a more robust signal for data transmission. This feature is critical in environments where data accuracy and reliability are paramount.
Self-Calibration
The module features an internal self-calibration mechanism through the ZQ pin, ensuring consistent performance across various temperature and voltage conditions. This self-calibration aids in maintaining optimal performance without manual intervention.
On-Die Termination (ODT)
On-Die Termination via the ODT pin contributes to signal integrity, reducing signal reflections and noise for better performance and stability. The memory module is designed with a height of 1.180” (30mm), including the heatsink, to ensure physical compatibility with a wide range of hardware setups.